With Design-For-Test (DFT), test coverage is the typical yardstick used to gauge the quality of the manufacturing tests being performed. But as next-generation designs become more complex, traditional ...

In today’s highly competitive semiconductor industry, chip-design companies strive for competitive advantages by optimizing designs for PPA (Power, Performance, Area). Along with the functional logic, ...

The testing and verification of semiconductor chips was a prominent topic at this year’s European Test Systems (ETS) conference, especially in the area of Design-for-Test (DFT) tools and techniques.

Detection and monitoring of the yield loss mechanisms and defects in product chips have been a subject of extensive efforts, resulting in multiple useful Design-for-Manufacturing (DFM) and ...